1.Responsible for Process & Packaging NPI at AMD R&D Suzhou.
2.Coordinate and responsible for new product Packaging/process development and qualification at AMD Suzhou.
3.Drive and work with Assembly process team for yield improvement during NPI stage.
4.Participate in problem solving of Assembly & packaging related Failure Analysis.
5.Familiar with the quality and reliability test conditions and specifications.
6.Interface with materials suppliers for engineering and quality related issues.
7.Team lead responsible to guide junior engineers.
8.Others tasks assigned by supervisor.
1,5-8 years’ industrial experience with 3-5 years’ in flip chip packaging & process development
2,Excellent oral and written skills in English and Mandarin
3,Bachelor degree in mechanical or materials Engineering or equivalent
5,Good understanding of Semiconductor processes.
6,Experience and knowledge in C4 Assembly and packaging technology
7,Knowledge on Six Sigma and Lean