R&D-Sr. Packaging Development Engineer 产品开发
R&D-Sr. Packaging Development Engineer 产品开发
18.2-25.2万
苏州工业园区 | 5年以上经验
发布时间:2018-09-22 23:30:29 | 截止时间:2018-12-31
基本信息:
  • 电子技术研发工程师
  • 全职
  • 若干
  • R&D
职位描述及要求:
  • Job Responsibilities
    1.Responsible for Process & Packaging NPI at AMD R&D Suzhou.
    2.Coordinate and responsible for new product Packaging/process development and qualification at AMD Suzhou.
    3.Drive and work with Assembly process team for yield improvement during NPI stage.
    4.Participate in problem solving of Assembly & packaging related Failure Analysis.
    5.Familiar with the quality and reliability test conditions and specifications.
    6.Interface with materials suppliers for engineering and quality related issues.
    7.Team lead responsible to guide junior engineers.
    8.Others tasks assigned by supervisor.

    Job Qualification:
    1,5-8 years’ industrial experience with 3-5 years’ in flip chip packaging & process development
    2,Excellent oral and written skills in English and Mandarin
    3,Bachelor degree in mechanical or materials Engineering or equivalent
    4,Project Management
    5,Good understanding of Semiconductor processes.
    6,Experience and knowledge in C4 Assembly and packaging technology
    7,Knowledge on Six Sigma and Lean

    候选人条件符合或获得过“双创人才”、“万人计划”、“千人计划”等省、国家级人才计划者优先录用。
岗位条件:
  • 本科
  • 英语 精通
  • 不限
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  • 外商独资、外企办事处
  • 电子技术/半导体/集成电路
  • 1000-1999
  • 苏州工业园区苏桐路88号
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